Ceramic based PCB
Product attributes
Min hole size：0.1mm
Metallization Process：DPC, DBC, COB
Finish board thickness：15um-200um
Surface finish：ENIG, Immersion silver
Product features
Finish board thickness
＞0.2mm
Hole metallization
Electroplating filling vias, silver paste filling vias
Applications
Communications
Related products
Metal based (core) PCB
Metal material：Aluminium, copper
Copper foil thickness：≤6 OZ
Copper layers：Single-sided, double sided, multilayer metal core
Thermal conductivity：2-12w/m∙k
Thermo-electric separation PCB
Material：Thermal conductivity (0.3-2W/m∙k)
Thermal pad treatment：Flat, Sinking
Outer layer copper(base)：0.5-18oz
Copper base thickness：0.8-3.2mm
High frequency board
Material：Rogers,Taconic,Arlon,Panasonic,TUC,Wangling
Structure：Single material,hybrid pressing,metal based.
Surface finish：Copper,OSP,ENIG,Immersion Tin, HASL
Max layer count ：16
Millimeter wave radar board
Material：PTFE+FR-4
Linear precision：±8μm
Special technology：Blind & buried vias, POFV.
Technology advantage：PTFE multi-layer, Hybrid pressing.
EA value：≤15um
