必一

Metal material：Aluminium, copper

Copper foil thickness：≤6 OZ

Copper layers：Single-sided, double sided, multilayer metal core

Thermal conductivity：2-12w/m∙k

Material
：Thermal conductivity (0.3-2W/m∙k)

Thermal pad treatment
：Flat, Sinking

Outer layer copper(base)：0.5-18oz

Copper base thickness：0.8-3.2mm

Bus bar material：Pure copper

Min conductor space
：0.8mm

Copper thickness：1.0mm-3.0mm

Board thickness：2.0mm-10.0mm