Metal based (core) PCB
Metal material：Aluminium, copper
Copper foil thickness：≤6 OZ
Copper layers：Single-sided, double sided, multilayer metal core
Thermal conductivity ：2-12w/m∙k
Thermo-electric separation PCB
Material ：Thermal conductivity (0.3-2W/m∙k)
Thermal pad treatment ：Flat, Sinking
Outer layer copper(base)：0.5-18oz
Copper base thickness ：0.8-3.2mm
High frequency board
Material ：Rogers,Taconic,Arlon,Panasonic,TUC,Wangling
Structure：Single material,hybrid pressing,metal based.
Surface finish：Copper,OSP,ENIG,Immersion Tin, HASL
Max layer count ：16
Millimeter wave radar board
Material：PTFE+FR-4
Linear precision ：±8μm
Special technology：Blind & buried vias, POFV.
Technology advantage ：PTFE multi-layer, Hybrid pressing.
EA value ：≤15um
Stepped G/F board
Board thickness：rn≥2.0mm
G/F thickness：≤1.6mm±0.1mm
G/F tolerance：±0.05mm
Layer count：≤44 layers
Optical transceiver
Material：FR4, high frequency, high speed material
Finger size tolerance：±0.075mm
Special technology ：HDI micorvia filling
Signal transmission rate：≤100 Gbps
Address: No.389 Shetang road, Economic and Technological Development Zone, Changsha, China.
TEL: 0731-82786288-6818
Email: sales02@mujingguan.com
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